EANS-News: Identive Group Inc. / Yeldi Group Selects Identive and NXP for Launch of First Major Mobile NFC Cashless Payment Solution in India

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Marketing

Subtitle: Innovative NFC tags work with consumers’ mobile phones to
enable cashless payments

SANTA ANA, Calif., ISMANING, Germany and Eindhoven, Netherlands,
October 9, 2012 (euro adhoc) - Identive Group, Inc. (NASDAQ: INVE;
Frankfurt: INV) and NXP Semiconductors N.V. (NASDAQ: NXPI) today
announced that they are providing innovative near field communication
(NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of
its 'ara eTap' cashless payment application in India. The NFC payment
tags are affixed to the back of a mobile phone to enable cashless
"tap and pay" transactions.

"Mobile technology is rapidly being adopted by a broad demographic in
India, which is spurring significant interest in mobile commerce,"
said Lakshmi Deepa, chief executive officer of Yeldi Softcom, a
subsidiary of the Yeldi Group that focuses on the development of
telecommunications technology. "The NFC payment tags from Identive
and NXP make it possible for us to equip Indian consumers with the
means of making cashless payments and other transactions without the
need for a more expensive smart phone with in-built NFC. The tags can
be used with both new and existing mobile phones, making the ara eTap
application available to the majority of the population. Transactions
are secure and the ability to reload cash to the tag adds to the
convenience."

With targeted deployment of 300,000 mobile phones and millions of NFC
tags, Yeldi Softcom aims to speed the transition from cumbersome,
cash-based transactions to a world of convenient mobile payments for
Indian consumers. ara eTap customers can use the NFC payment tag to
load cash onto their phones from their personal bank accounts or from
a special escrow account set up with Yeldi Softcom. In addition to
paying for retail items, tag holders can use the application to pay
utility bills, recharge mobiles or book movie and travel tickets, and
also can earn reward points on every usage. Yeldi Softcom expects to
launch ara eTap in the coming months and is currently signing up
merchants across India to distribute the NFC payment tags and support
the cashless payment application.

To address Yeldi Softcom's requirements for the ara eTap program,
Identive developed a unique NFC payment tag based on its
patent-pending tom® (tag on metal) smart inlay technology, which
shields the tag's radio frequency signal from the metal in the mobile
phone to allow a reliable, high-performance connection between the
tag and phone. The tag is manufactured using an abrasion-resistant
surface and unique printing process that offers unsurpassed
protection and longevity when deployed on mobile phones in the field.

For the chip technology within the tag, Identive worked closely with
its longstanding tag IC provider NXP Semiconductors, the co-inventor
and market leader of NFC. "Yeldi's new ara eTap is a major step
forward for micro cashless payment in India and beyond. NXP, the
leader in the global identification market, provides Identive and
Yeldi with a complete payment solution based on our secure MIFARE
DESFire platform and award winning PN65 mobile transaction IC. The
MIFARE DESFire ICs for Identive's Yeldi project are NFC tag type 4
compliant and already successfully used in the New Delhi, Bengaluru
and Mumbai transport ticketing schemes," said Martin Gruber, general
manager, MIFARE product line, NXP Semiconductors.

"Identive has made a significant investment in developing innovative
NFC technology to support cashless payment applications such as ara
eTap and we are pleased to support the launch of this ground-breaking
program," said Dr. Manfred Mueller, COO of Identification Products
for Identive.

At SmartCards Expo 2012 (NSIC Exhibition Ground, Okhla Industrial
Estate, New Delhi, October 10-12) visitors can learn more about
Yeldi's Mobile NFC Cashless Payment Solution at the NXP booth (#A1)
as well as Identive's booth (#C1).

About Identive Identive Group, Inc. (NASDAQ: INVE; Frankfurt: INV) is
focused on building the world's signature company in Secure ID. The
company's products, software, systems and services address the
markets for identity management, physical and logical access control,
cashless payment, NFC solutions and a host of RFID-enabled
applications for customers in the government, enterprise, consumer,
education and healthcare sectors. Identive's mission is to build a
lasting business of scale and technology based on a combination of
strong technology-driven organic growth and disciplined acquisitive
expansion. The company delivers up-to-date information on its
activity as well as industry trends through its industry-leading
social media initiatives and educational resource, AskIdentive.com.
For additional information, please visit www.identive-group.com or
follow on Twitter at @IdentiveGroup.

About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI)
provides High Performance Mixed Signal and Standard Product solutions
that leverage its leading RF, Analog, Power Management, Interface,
Security and Digital Processing Expertise. These innovations are used
in a wide range of automotive, identification, wireless
infrastructure, lighting, industrial, mobile, consumer and computing
applications. A global semiconductor company with operations in more
than 25 countries, NXP posted revenue of $4.2 billion in 2011.
Additional information can be found by visiting www.nxp.com.

Note: tom is a registered trademark of Identive Group, Inc. MIFARE
and MIFARE DESFire are trademarks of NXP Semiconductors. All other
trademarks are the property of their respective owners.

Forward-looking Statements This document includes forward-looking
statements which include statements regarding NXP Semiconductors'
business strategy, financial condition, results of operations, and
market data, as well as any other statements which are not historical
facts. By their nature, forward-looking statements are subject to
numerous factors, risks and uncertainties that could cause actual
outcomes and results to be materially different from those projected.
These factors, risks and uncertainties include the following: market
demand and semiconductor industry conditions, our ability to
successfully introduce new technologies and products, the demand for
the goods into which our products are incorporated, our ability to
generate sufficient cash, raise sufficient capital or refinance our
debt at or before maturity to meet both our debt service and research
and development and capital investment requirements, our ability to
accurately estimate demand and match our production capacity
accordingly or obtain supplies from third-party producers, our access
to production from third-party outsourcing partners, and any events
that might affect their business or our relationship with them, our
ability to secure adequate and timely supply of equipment and
materials from suppliers, our ability to avoid operational problems
and product defects and, if such issues were to arise, to correct
them quickly, our ability to form strategic partnerships and joint
ventures and successfully cooperate with our alliance partners, our
ability to win competitive bid selection processes to develop
products for use in our customers' equipment and products, our
ability to successfully establish a brand identity, our ability to
successfully hire and retain key management and senior product
architects; and, our ability to maintain good relationships with our
suppliers. In addition, this document contains information
concerning the semiconductor industry and our business segments
generally, which is forward-looking in nature and is based on a
variety of assumptions regarding the ways in which the semiconductor
industry, our market segments and product areas will develop. We
have based these assumptions on information currently available to
us, if any one or more of these assumptions turn out to be incorrect,
actual market results may differ from those predicted. While we do
not know what impact any such differences may have on our business,
if there are such differences, our future results of operations and
our financial condition could be materially adversely affected.
Readers are cautioned not to place undue reliance on these
forward-looking statements, which speak to results only as of the
date the statements were made. Except for any ongoing obligation to
disclose material information as required by the United States
federal securities laws, we do not have any intention or obligation
to publicly update or revise any forward-looking statements after we
distribute this document, whether to reflect any future events or
circumstances or otherwise. For a discussion of potential risks and
uncertainties, please refer to the risk factors listed in our SEC
filings. Copies of our SEC filings are available from on our Investor
Relations website, http://www.nxp.com/investor or from the SEC
website, http://www.sec.gov.

Further inquiry note:
Contacts:
Identive Group
Ms. Darby Dye
+1 949 553-4251
ddye@identive-group.com

Mr. Lennart Streibel
+49 89 9595-5195
lstreibel@identive-group.com

NXP Semiconductors
Mr. Michael Maader
+49 (0)40 5613 3371
michael.maader@nxp.com

end of announcement euro adhoc
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company: Identive Group Inc.
Carnegie Ave., Bldg. B 1900
US-CA 92705 Santa Ana
phone: +1 949 553 4280
FAX: +49 89 9595-5555
mail: investorrelations@identive-group.com
WWW: http://www.identive-group.com
sector: Computing & Information Technology
ISIN: US45170X1063
indexes: NASDAQ
stockmarkets: free trade: Berlin, München, Hamburg, Düsseldorf, Stuttgart,
Nasdaq: New York, Open Market / Entry Standard: Frankfurt
language: English