EANS-News: 80 Plus GIGA HS: Semiconductor Innovation by PVA TePla for Microchip Packaging

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New Products

Wettenberg (euro adhoc) - - New industry standards for
throughput

- Higher yield
- 100x300mm leadframe ready
- Presented at SEMICON Taiwan 2012

(Kirchheim/Munich, October 19, 2012) - The business unit Plasma
Systems of PVA TePla in Kirchheim/Munich unveiled the next generation
strip processing plasma system (100x300mm leadframe ready - High
Speed Plasma), setting new industry standards in throughput at
SEMICON Taiwan 2012.

The 80 Plus High Speed (HS) is the only single chamber system in the
world featuring patent pending innovations in strip size conversion,
handling and process, allowing up to three times higher units per
hour (UPH) compared to other leadframe and substrate strip processing
plasma systems to date. The system is targeted at high volume chip
manufacturers improving yield and reliability for applications prior
wire bonding, mold and flip chip underfill.

The 80 Plus High Speed is available in radio frequency (RF) and
microwave (MW) technology to provide the best process solution to
meet customer demands. In semiconductor microchip packaging plasma
-prior wirebonding- is essential for improving the cleanliness of the
bond pads. Ball shear and stitch pull strengths are dramatically
enhanced by plasma cleaning. Plasma cleaning and activation is used
in applications of adhesion promotion of mold compounds, eliminating
yield loss due to delamination. In Flip Chip packaging technology MW
plasma prior underfill has become a must for yield improvement.
Advanced Flip Chip devices are gaining in market prominence, and
microwave plasma processes are unrivalled at penetrating the minute
gaps beneath the dies.

Further inquiry note:
Helge Lüsebrink
PVA TePla AG
Ammerthalstrasse 34
85551 Kirchheim/Munich
Germany
Phone +49(0)89 905 03 - 126
Fax +49(0)89 905 03 - 147
helge.luesebrink@pvatepla.com

www.pvatepla.com
www.pvateplaamerica.com

Product information is available:
http://www.tepla.com/semi.php

end of announcement euro adhoc
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company: PVA TePla AG
Im Westpark 10-12
D-35435 Wettenberg
phone: +49(0)641 68690-0
FAX: +49(0)641 68690-800
mail: ir@pvatepla.com
WWW: http://www.pvatepla.com
sector: Misc. Industrials
ISIN: DE0007461006
indexes: CDAX
stockmarkets: free trade: Hannover, Berlin, München, Hamburg, Düsseldorf,
Stuttgart, regulated dealing/prime standard: Frankfurt
language: English